As we know, Qualcomm Snapdragon 810 chipset has been seen to overheat many times. On the other hand, this chip is currently top of the line offering of the maker. So, we can understand that smartphone makers are in a state where they are forced to use it for their flagship phones. Sony’s new Xperia Z5 Premium also goes with the same Snapdragon 810 chipset because it won’t have made sense to pair a 4K touchscreen with something less.
But what about it’s heating capacity? An image is leaked via Weibo which shows a disassembled Xperia Z5 Premium phone, a unit which suffered the issue if Snapdragon chipset to get overheated. From the pictures, it is clear that a dual heat pipe is sitting on the upper side of this smartphone to take care of Snapdragon’s 810 chip with proper ventilation. Sony has also applied a lot of thermal paste on this phone innards, in order to make things less prone to overheating.